Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
August 17, 2021
0Patent Application Number
201801220
Date Filed
January 22, 2018
0Patent abstract
A method for producing a wired circuit board including a stainless steel supporting layer having a stainless steel terminal includes a first step of preparing the stainless steel supporting layer having a passive film formed on the surface thereof and a second step of forming a first gold plating layer on the surface of the stainless steel terminal. In the second step, the stainless steel supporting layer is immersed in a first gold plating solution containing a weak acid and a gold compound without containing a strong acid, and electricity is supplied to the stainless steel supporting layer so that the passive film is removed and the first gold plating layer is formed on the surface of the stainless steel terminal.
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