Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Katsuya Hirakawa0
Itsuo Wakabayashi0
Kazunori Takata0
Toshio Iwahara0
Date of Patent
July 6, 2021
0Patent Application Number
168043380
Date Filed
February 28, 2020
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A binding structure of wire routing materials are formed by: elongated wire routing materials; a binding member for binding the wire routing materials; and an engaging member including a movable body portion including an engaging portion for assembly into a vehicle body, and a bound portion to be bound and held together with the wire routing materials by the binding member. The bound portion includes a main portion facing the wire routing materials, and a leg portion extending from the main portion and being in contact with the wire routing materials. The movable body portion includes a sliding portion disposed such that sliding thereof is allowed on the wire routing materials in a gap.
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