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US Patent 11052267 Back pain treatment using microwave sources

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Contents

Is a
Patent
Patent
0

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
110522670
Patent Inventor Names
David S. Bradford0
Will Nau0
Chris J. Diederich0
Jeffrey C. Lotz0
Date of Patent
July 6, 2021
0
Patent Application Number
161610250
Date Filed
October 15, 2018
0
Patent Citations
‌
US Patent 10603522 Method of treating back pain with microwave sources
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US Patent 10589131 Methods of delivering chemical denervation to the vertebral body
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US Patent 10898254 Implantable thermal treatment method and apparatus
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US Patent 10272271 Method for providing directional therapy to skeletal joints
Patent Citations Received
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US Patent 11426199 Methods of treating a vertebral body
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US Patent 11471210 Methods of denervating vertebral body using external energy source
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US Patent 11596468 Intraosseous nerve treatment
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US Patent 11291502 Methods of navigation and treatment within a vertebral body
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US Patent 11471171 Bipolar radiofrequency ablation systems for treatment within bone
Patent Primary Examiner
‌
Aaron F Roane
0
Patent abstract

An ultrasound therapy system and method is provided that provides directional, focused ultrasound to localized regions of tissue within body joints, such as spinal joints. An ultrasound emitter or transducer is delivered to a location within the body associated with the joint and heats the target region of tissue associated with the joint from the location. Such locations for ultrasound transducer placement may include for example in or around the intervertebral discs, or the bony structures such as vertebral bodies or posterior vertebral elements such as facet joints. Various modes of operation provide for selective, controlled heating at different temperature ranges to provide different intended results in the target tissue, which ranges are significantly affected by pre-stressed tissues such as in-vivo intervertebral discs. In particular, treatments above 70 degrees C., and in particular 75 degrees C., are used for structural remodeling, whereas lower temperatures achieve other responses without appreciable remodeling.

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