US Patent 11043466 Radio frequency modules

Packaged modules for use in wireless devices are disclosed. A substrate supports integrated circuit die including at least a portion of a baseband system and a front end system, an oscillator assembly, and an antenna. The oscillator assembly includes an enclosure to enclose the oscillator and conductive pillars formed at least partially within a side of the enclosure to conduct signals between the top and bottom surfaces of the oscillator assembly. Components can be vertically integrated to save space and reduce trace length. Vertical integration provides an overhang volume that can include discrete components. Radio frequency shielding and ground planes within the substrate shield the front end system and antenna from radio frequency interference. Stacked filter assemblies include passive surface mount devices to filter radio frequency signals.