US Patent 11035985 Multi-lenslet PIC imagers and packaging configurations
Patent 11035985 was granted and assigned to Lockheed Martin on June, 2021 by the United States Patent and Trademark Office.
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Patent abstract
A dual-lenslet array photonic integrated circuit (PIC) imager includes a PIC and top and bottom substrate spacers. A first optical prism couples a first lenslet array to a first-side edge of the PIC. A second optical prism couples a second lenslet array to a second-side edge of the PIC. Lenslets of the first lenslet array and respective lenslets of the second lenslet array are coupled to respective waveguides embedded in the in the PIC.
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
110359850
Date of Patent
June 15, 2021
0Patent Application Number
162879800
Date Filed
February 27, 2019
0Official Website
Patent Citations
Patent Citations Received
Patent Primary Examiner
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Patent Citations Received
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Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
110359850
Date of Patent
June 15, 2021
0Patent Application Number
162879800
Date Filed
February 27, 2019
0Official Website
Patent Citations
Patent Primary Examiner
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US Patent 11035985 Multi-lenslet PIC imagers and packaging configurations
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
11035985
Date of patent
June 15, 2021
Patent application number
16287980
Date Filed
February 27, 2019
Patent citations
Patent primary examiner
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