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US Patent 11033887 High charge density metallophosphate molecular sieves

Patent 11033887 was granted and assigned to Honeywell UOP on June, 2021 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent

Patent attributes

Patent Applicant
Honeywell UOP
Honeywell UOP
Current Assignee
Honeywell UOP
Honeywell UOP
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11033887
Date of Patent
June 15, 2021
Patent Application Number
16594144
Date Filed
October 7, 2019
Patent Citations
‌
US Patent 10427145 High charge density Metalloaluminophosphosilicate molecular sieves MeAPSO-82
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US Patent 10449526 High charge density metallophosphate molecular sieves
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US Patent 10449527 High charge density silicometallophosphate molecular sieves SAPO-79
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US Patent 10449528 High charge density silicometallophosphate molecular sieves
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US Patent 10471415 High charge density metallophosphate molecular sieves
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US Patent 10518256 High charge density metallophosphate molecular sieves
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US Patent 10562016 High charge density metallophosphate molecular sieves
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US Patent 10570021 Crystalline metallophosphates, their method of preparation, and use
...
Patent Primary Examiner
‌
David M. Brunsman
Patent abstract

A new family of highly charged crystalline microporous metallophosphate molecular sieves has been synthesized. These metallophosphates are represented by the empirical formula of:Rp+rA+mM2+xEyPOz where A is an alkali metal cation, R is at least one quaternary organoammonium cation, M is a divalent metal such as zinc and E is a trivalent framework element such as aluminum or gallium. This family of high charge density metallophosphate materials are among the first metalloalumino(gallo)phosphate-type molecular sieves to be stabilized by combinations of alkali and quaternary organoammonium cations, enabling unique compositions. This family of high charge density metallophosphate molecular sieves has catalytic properties for carrying out various hydrocarbon conversion processes and separation properties for separating at least one component.

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