Patent 11025276 was granted and assigned to Qualcomm on June, 2021 by the United States Patent and Trademark Office.
Certain aspects of the present disclosure generally relate to techniques for enhanced puncturing and low-density parity-check (LDPC) code structure. A method for wireless communications by a transmitting device is provided. The method generally includes encoding a set of information bits based on a LDPC code to produce a code word, the LDPC code defined by a base matrix having a first number of variable nodes and a second number of check nodes; puncturing the code word according to a puncturing pattern designed to puncture bits corresponding to at least two of the variable nodes to produce a punctured code word; adding at least one additional parity bit for the at least two punctured variable nodes; and transmitting the punctured code word.