US Patent 11006514 Three-dimensional decoupling integration within hole in motherboard
Patent 11006514 was granted and assigned to Intel on May, 2021 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
March 30, 2017
Date of Patent
May 11, 2021
Patent Applicant
Patent Application Number
16481043
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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