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US Patent 11004740 Structure and method for interconnection with self-alignment

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
September 4, 2019
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Date of Patent
May 11, 2021
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Patent Application Number
16560717
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Patent Citations
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US Patent 10600688 Methods of producing self-aligned vias
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US Patent 10714421 Structure and formation method of semiconductor device with self-aligned conductive features
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US Patent 10032632 Selective gas etching for self-aligned pattern transfer
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US Patent 10403542 Methods of forming self-aligned vias and air gaps
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US Patent 10510540 Mask scheme for cut pattern flow with enlarged EPE window
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US Patent 10553485 Methods of producing fully self-aligned vias and contacts
Patent Citations Received
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US Patent 11640924 Structure and method for interconnection with self-alignment
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Patent Inventor Names
Yu-Chieh Liao
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Hsin-Ping Chen
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Shau-Lin Shue
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Tai-I Yang
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Chia-Tien Wu
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Hai-Ching Chen
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11004740
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Patent Primary Examiner
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David A Zarneke
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