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US Patent 11003610 Multichip package link

Patent 11003610 was granted and assigned to Intel on May, 2021 by the United States Patent and Trademark Office.

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Edits on 12 Dec, 2023
"Add patent abstract"
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Golden AI
edited on 12 Dec, 2023
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Patent abstract

Physical layer logic is provided that is to receive data on one or more data lanes of a physical link, receive a valid signal on another of the lanes of the physical link identifying that valid data is to follow assertion of the valid signal on the one or more data lanes, and receive a stream signal on another of the lanes of the physical link identifying a type of the data on the one or more data lanes.

Edits on 20 Sep, 2023
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edited on 20 Sep, 2023
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Patent Citations Received
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US Patent 11765849 Daughter card plug detection
Edits on 24 May, 2023
"Remove website redirecting to Patent Public Search front page"
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Golden AI
edited on 24 May, 2023
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=1100361000
Edits on 3 Apr, 2023
"Entity importer update"
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edited on 3 Apr, 2023
Infobox
Is a
Patent
Patent
0
Patent Applicant
Intel
Intel
0
Current Assignee
Intel
Intel
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
110036100
Date of Patent
May 11, 2021
0
Patent Application Number
167793770
Date Filed
January 31, 2020
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=110036100
Patent Citations
‌
US Patent 10073808 Multichip package link
0
‌
US Patent 10204064 Multislot link layer flit wherein flit includes three or more slots whereby each slot comprises respective control field and respective payload field
0
Patent Primary Examiner
‌
Tammara R Peyton
0
Edits on 29 Mar, 2023
"update citations for inverse infoboxes"
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Golden AI
edited on 29 Mar, 2023
Edits on 25 Sep, 2022
"update citations for inverse infoboxes"
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Golden AI
edited on 25 Sep, 2022
"update citations for inverse infoboxes"
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Golden AI
edited on 24 Sep, 2022
Edits on 23 Sep, 2022
"Entity importer update"
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Golden AI
edited on 23 Sep, 2022
Infobox
Is a
Patent
Patent
0
Patent Applicant
Intel
Intel
0
Current Assignee
Intel
Intel
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
110036100
Date of Patent
May 11, 2021
0
Patent Application Number
167793770
Date Filed
January 31, 2020
0
Official Website
https://pdfpiw.uspto.gov/.piw?Docid=110036100
Patent Citations
‌
US Patent 10073808 Multichip package link
0
‌
US Patent 10204064 Multislot link layer flit wherein flit includes three or more slots whereby each slot comprises respective control field and respective payload field
0
Patent Primary Examiner
‌
Tammara R Peyton
0
Edits on 6 Jun, 2022
"Entity importer update"
Golden AI profile picture
Golden AI
edited on 6 Jun, 2022
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
https://pdfpiw.uspto.gov/.piw?Docid=11003610
Edits on 11 Feb, 2022
"Created via: Entity Importer"
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Golden AI
created this topic on 11 Feb, 2022
Edits made to:
Infobox (+11 properties)
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 US Patent 11003610 Multichip package link

Infobox
Is a
Patent
Patent
Patent applicant
Intel
Intel
Current assignee
Intel
Intel
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
11003610
Date of patent
May 11, 2021
Patent application number
16779377
Date Filed
January 31, 2020
Patent citations
‌
US Patent 10073808 Multichip package link
‌
US Patent 10204064 Multislot link layer flit wherein flit includes three or more slots whereby each slot comprises respective control field and respective payload field
Patent primary examiner
‌
Tammara R Peyton

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