Patent attributes
A compensated via structure is utilized in a multi-layer printed circuit board (PCB) stackup to improve the radio frequency (RF) transmission performance of the PCB. The compensated via structure includes a compensating structure and a central via surrounded by multiple grounding posts, wherein both ends of the central via are connected to the input and the output transmission lines through pads. The compensating structure is within a ground plane located in between of the two layers within which the input and output transmission lines are. The increased coupling between the central via and the grounding posts and between the compensating structure and the ground plane results in reductions in both return and insertion losses and contributes to the improved RF transmission performance.
