Patent attributes
A radio frequency module includes: a module board including a first principal surface and a second principal surface on opposite sides of the module board; an antenna connection terminal; a diplexer connected to the antenna connection terminal and including at least a first inductor which is a chip inductor; a transmission power amplifier configured to amplify a transmission signal; a reception low noise amplifier configured to amplify a reception signal; and a second inductor which is a chip inductor disposed on one of a transmission path connecting the diplexer and the transmission power amplifier and a reception path connecting the diplexer and the reception low noise amplifier. The first inductor is mounted on the first principal surface, and the second inductor is mounted on the second principal surface.
