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US Patent 10930709 Stacked transparent pixel structures for image sensors

Patent 10930709 was granted and assigned to Lockheed Martin on February, 2021 by the United States Patent and Trademark Office.

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Patent abstract

In one embodiment, a pixel for an image sensor includes a first subpixel and a second subpixel stacked on top of the first subpixel. Each of the first and second subpixels include a polygon shape. Each of the first and second subpixels include a photodetector layer, a transparent cathode layer, and a transparent anode layer.

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Patent Inventor Names
Mark A. Lamkin0
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Official Website
https://pdfpiw.uspto.gov/.piw?Docid=109307090
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Patent Citations Received
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US Patent 11469285 Display substrate having bridge connected island portions and display device
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https://pdfpiw.uspto.gov/.piw?Docid=10930709
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 US Patent 10930709 Stacked transparent pixel structures for image sensors

Infobox
Is a
Patent
Patent
Patent applicant
Lockheed Martin
Lockheed Martin
Current assignee
Lockheed Martin
Lockheed Martin
Patent jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent number
10930709
Date of patent
February 23, 2021
Patent application number
15724027
Date Filed
October 3, 2017
Patent citations
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US Patent 10129984 Three-dimensional electronics distribution by geodesic faceting
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US Patent 10249800 Stacked transparent pixel structures for electronic displays
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US Patent 10510812 Display-integrated infrared emitter and sensor structures
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US Patent 10594951 Distributed multi-aperture camera array
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US Patent 10698201 Plenoptic cellular axis redirection
Patent primary examiner
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Mounir S Amer

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