US Patent 10913211 High rate ultrasonic sealer

Embodiments herein include a system for joining components. The system can include a rotating base platform, a plurality of receptacles mounted to the base platform, and a rotating sonotrode platform. A plurality of sonotrodes are mounted to the sonotrode platform. Each sonotrode can correspond to a receptacle. Each sonotrode can move in a reciprocating motion between a release position distant from a corresponding receptacle and a compressing position proximal to the corresponding receptacle. The compressing position occurs at a first angular position of the sonotrode platform. Each sonotrode is energized at the compressing position.