Patent attributes
An musical instrument amplifier-mounted microphone assembly operatively attaches to the seal of an instrument speaker to capture sound waves, without losing unique sounds. The microphone assembly utilizes electret condenser microphones to achieve boundary layer configuration. The microphone assembly fits flush against, or parallel to, the speaker baffle that holds the microphone assembly in front of speaker cones. The microphone assembly mounts on a circuit board which acts as a reflective surface to achieve boundary layer effect. The flat circuit board provides flat conductor traces that carry audio signals from the electret assembly, past the gasket seal of the speaker, to electronics on the board that power, amplify and match impedances needed to pass the audio signal to a large venue amplification system. A connector terminal on the circuit board connects via a shielded cable to a housing mounted XLR connector that provides connection to a large venue amplification system.
