US Patent 10908651 Electronic device housing
Patent 10908651 was granted and assigned to Toray Industries on February, 2021 by the United States Patent and Trademark Office.
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Patent abstract
An electronic device housing includes: a bottom cover; a top cover; a partition structure that is disposed in a space divided by the bottom cover and the top cover and has an opening; and a heat generation member. The partition structure is joined to the bottom cover or the top cover to form a hollow structure, and the heat generation member is disposed on a surface of the partition structure on the hollow structure side.
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Patent Inventor Names
Masato Honma0
Naokichi Imai0
Takashi Fujioka0
Yoshiki Takebe0
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US Patent 10908651 Electronic device housing
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Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10908651
Date of patent
February 2, 2021
Patent application number
15760735
Date Filed
September 6, 2016
Patent primary examiner
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