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US Patent 10890355 Heat pump apparatus

Patent 10890355 was granted and assigned to Mitsubishi Electric Corporation on January, 2021 by the United States Patent and Trademark Office.

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Patent abstractTimelineTable: Further ResourcesReferences
Is a
Patent
Patent
1

Patent attributes

Patent Applicant
Mitsubishi Electric Corporation
Mitsubishi Electric Corporation
1
Current Assignee
Mitsubishi Electric Corporation
Mitsubishi Electric Corporation
1
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
108903551
Patent Inventor Names
Shigetoshi Ipposhi1
Yasumitsu Nomura1
Date of Patent
January 12, 2021
1
Patent Application Number
164868741
Date Filed
November 22, 2017
1
Patent Citations
‌
US Patent 10345004 Integrated heat pump and water heating circuit
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US Patent 10323870 Optimizing liquid temperature and liquid pressure in a modular outdoor refrigeration system
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US Patent 10535245 Heat pump system and method for monitoring valve leaks in a heat pump system
Patent Citations Received
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US Patent 12018870 Air conditioning and heat pump system with energy efficient heat exchanger
5
Patent Primary Examiner
‌
Daniel E Namay
1
Patent abstract

A heat pump apparatus includes a use-side heat exchanger that causes heat exchange to be performed between a heat medium flowing from a heat-storage heat exchanger and a heat usage medium, and a flow-passage switching device that switches a flow passage for the heat medium to a first flow passage that circulates through a heat-reception-side heat exchanger and the heat-storage heat exchanger without extends through the use-side heat exchanger or a second flow passage that circulates through the heat-reception-side heat exchanger and the heat-storage heat exchanger via the use-side heat exchanger. Even when the temperature of the heat storage medium rises, heat received from a heat source can be stored in the heat storage medium by a heat pump, while a decrease of the efficiency of the heat pump can be reduced.

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