US Patent 10886230 Fan-out semiconductor package
Patent 10886230 was granted and assigned to Samsung on January, 2021 by the United States Patent and Trademark Office.
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Patent abstract
A fan-out semiconductor package is provided. A semiconductor chip is disposed in a through hole of a first connection member. At least a portion of the semiconductor chip is encapsulated by an encapsulant. A second connection member including a redistribution layer is formed on an active surface of the semiconductor chip. An external connection terminal having excellent reliability is formed on the encapsulant.
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Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
108862300
Date of Patent
January 5, 2021
0Patent Application Number
157163010
Date Filed
September 26, 2017
0Official Website
Patent Citations Received
Patent Primary Examiner
Edits on 14 Dec, 2022
Golden AI
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Infobox (+1 properties)
Infobox
Patent Citations Received
Edits on 25 Sep, 2022
Golden AI
Infobox
Is a
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
108862300
Date of Patent
January 5, 2021
0Patent Application Number
157163010
Date Filed
September 26, 2017
0Official Website
Patent Primary Examiner
Edits on 17 Jun, 2022
Golden AI
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Infobox (+1 properties)
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Golden AI
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US Patent 10886230 Fan-out semiconductor package
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10886230
Date of patent
January 5, 2021
Patent application number
15716301
Date Filed
September 26, 2017
Patent primary examiner
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