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US Patent 10879210 Bonded structures

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
December 20, 2019
Date of Patent
December 29, 2020
Patent Application Number
16723877
Patent Citations
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US Patent 10075657 Edgeless large area camera system
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US Patent 10204893 Stacked dies and methods for forming bonded structures
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US Patent 10269756 Die processing
0
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US Patent 10276619 Semiconductor device structure with a conductive feature passing through a passivation layer
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US Patent 10446456 Integrated circuits protected by substrates with cavities, and methods of manufacture
0
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US Patent 10276909 Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein
0
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US Patent 10522499 Bonded structures
0
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US Patent 10002844 Bonded structures
0
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US Patent 10026605 Method of reducing residual contamination in singulated semiconductor die
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Patent Citations Received
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US Patent 11855005 Crackstop with embedded passive radio frequency noise suppressor and method
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10879210
Patent Primary Examiner
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William Coleman

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