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US Patent 10811378 Electronic package and manufacturing method thereof

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
August 6, 2019
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Date of Patent
October 20, 2020
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Patent Application Number
16533751
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Patent Citations
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US Patent 10340241 Chip-on-chip structure and methods of manufacture
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US Patent 10699981 Non-vertical through-via in package
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US Patent 10535626 Structures and methods for low temperature bonding using nanoparticles
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US Patent 10734346 Method of manufacturing chip-on-chip structure comprising sinterted pillars
0
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US Patent 10290530 Info structure with copper pillar having reversed profile
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US Patent 10331161 Power supply board
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10811378
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Patent Primary Examiner
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Victoria K. Hall
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