US Patent 10790248 Three-dimensional integrated circuit and method of manufacturing the same
Patent 10790248 was granted and assigned to United Microelectronics Corporation on September, 2020 by the United States Patent and Trademark Office.
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Patent Number
107902480
Date of Patent
September 29, 2020
0Patent Application Number
162809380
Date Filed
February 20, 2019
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Patent Primary Examiner
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Patent Applicant
0
Current Assignee
0
Patent Jurisdiction
Patent Number
107902480
Date of Patent
September 29, 2020
0Patent Application Number
162809380
Date Filed
February 20, 2019
0Official Website
Patent Primary Examiner
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US Patent 10790248 Three-dimensional integrated circuit and method of manufacturing the same
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10790248
Date of patent
September 29, 2020
Patent application number
16280938
Date Filed
February 20, 2019
Patent primary examiner
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