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US Patent 10727142 Process monitoring of deep structures with X-ray scatterometry

Patent 10727142 was granted and assigned to KLA-Tencor on July, 2020 by the United States Patent and Trademark Office.

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United States Patent and Trademark Office

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Patent Number

Date of Patent

July 28, 2020

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Patent Application Number

159907490

Date Filed

May 28, 2018

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Patent Citations Received

US Patent 11408837 Analysis method for fine structure, and apparatus and program thereof

US Patent 11867595 X-ray reflectometry apparatus and method thereof for measuring three dimensional nanostructures on flat substrate

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US Patent 11435393 Enhancement of yield of functional microelectronic devices

US Patent 12136557 Integrated substrate measurement system to improve manufacturing process performance

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US Patent 11955391 Process monitoring of deep structures with X-ray scatterometry

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US Patent 11610297 Tomography based semiconductor measurements using simplified models

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US Patent 11688616 Integrated substrate measurement system to improve manufacturing process performance

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US Patent 11346882 Enhancement of yield of functional microelectronic devices

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