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US Patent 10705302 Photonic integrated circuit packages
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Is a
Patent
Date Filed
December 6, 2018
Date of Patent
July 7, 2020
Patent Application Number
16211712
Patent Citations
US Patent 10459163 Photonic chip with folding of optical path and integrated collimation structure
US Patent 10345524 Optical edge coupler with controllable mode field for photonic chip
US Patent 10481334 Fiber to chip optical coupler
US Patent 10146020 MEMS steering mirrors for applications in photonic integrated circuits
US Patent 10209442 Photonic chip with reflecting structure for folded optical path
Patent Citations Received
US Patent 11394468 System and method for transferring optical signals in photonic devices and method of making the system
0
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
10705302
Patent Primary Examiner
Michelle R. Connelly-Cushua
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