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US Patent 10611027 Assembly apparatus and control method therefor

Patent 10611027 was granted and assigned to Sony on April, 2020 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors

Is a

Patent

Patent attributes

Patent Applicant

Sony

Current Assignee

Sony

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

10611027

Date of Patent

April 7, 2020

Patent Application Number

15780863

Date Filed

November 29, 2016

Patent Citations

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US Patent 10279468 Industrial robot for performing processing on works

Patent Citations Received

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US Patent 12065317 Pallet transfer device for robot palletizing, a system for robot palletizing including the pallet transfer device and a method for robot palletizing

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US Patent 11707846 Apparatus having a first and a second robot and method for operation thereof

Patent Primary Examiner

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Ramesh B Patel

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