Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 4, 2020
Patent Application Number
16158780
Date Filed
October 12, 2018
Patent Citations
Patent Citations Received
Patent Primary Examiner
Patent abstract
Methods are provided for selectively depositing Al and N containing material on a first conductive surface of a substrate relative to a second, dielectric surface of the same substrate. In some aspects, methods of forming an Al and N containing protective layer or etch stop layer for use in integrated circuit fabrication are provided.
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