US Patent 10527775 Optical substrates having light collimating and diffusion structures

This invention discloses a method of forming an uneven structure on a substrate. Use a hard tool to penetrate into a mold to cut a first trench and a second trench in an order on a surface of a mold, wherein the hard tool has a smoothly-curved shape such that the transverse width of each of the first trench and the second trench increases as the penetrating depth of the hard tool increases, wherein when each of the first trench and the second trench marches along a first direction, the penetrating depth of the hard tool is controlled by repeating moving the hard tool up and down to cut the mold such that the transverse width of each of the first trench and the second trench varies according to the controlled penetrating depth of the hard tool, wherein the first trench and the second trench completely overlap with each other with no space therebetween. Then, use the surface of the mold to emboss a thin film on a substrate.