Patent attributes
A method for producing a flexible mounting substrate. The method comprises preparing a flexible substrate having a mounting region for mounting an electronic component on an arrangement surface of the flexible substrate, the electronic component including at least one bump, arranging a thermosetting anisotropic conductive film having conductive particles on the mounting region, arranging the electronic component on the anisotropic conductive film, and pressing the electronic component while heating to electrically connect the at least one bump of the electronic component to the mounting region of the flexible substrate, and adhering an adhesion film having an adhesive layer including an adhesive and a base film laminated together on a support surface that is opposite to the arrangement surface of the flexible substrate at least at a portion located on a back surface side of the mounting region before electrically connecting the electronic component and the mounting region.
