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US Patent 10517604 Implant delivery device

Patent 10517604 was granted and assigned to MicroVention on December, 2019 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent

Patent attributes

Current Assignee
MicroVention
MicroVention
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10517604
Patent Inventor Names
Jake Le0
Matthew Fitz0
Heath Bowman0
Date of Patent
December 31, 2019
Patent Application Number
15386492
Date Filed
December 21, 2016
Patent Citations Received
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US Patent 12127744 Embolic coil proximal connecting element and stretch resistant fiber
0
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US Patent 11457926 Implant having an intrasaccular section and intravascular section
0
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US Patent 11497504 Aneurysm treatment with pushable implanted braid
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US Patent 11937825 Hook wire for preventing premature embolic implant detachment
0
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US Patent 11951026 Implantable medical device detachment system with flexible braid section
0
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US Patent 11998213 Implant delivery with modified detachment feature and pull wire engagement
0
‌
US Patent 12011171 Systems and methods for inhibiting premature embolic implant deployment
0
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US Patent 12127743 Inverting braided aneurysm implant with dome feature
0
...
Patent Primary Examiner
‌
Diane D Yabut
Patent abstract

A system for delivering an implant within a patient is disclosed. The activation of the heater coil causes the degradation, melting or reduction of a component that brings the heater coil into or out of electrical contact with another component, or causes the individual loops of the coil to contact each other, thereby resulting a notable change in resistance in the circuit supplying the heater coil with electricity. A core wire terminates prior to the distal end of the device, allowing for greater flexibility.

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