US Patent 10511118 Recepticle assembly with thermal management
Patent 10511118 was granted and assigned to Yamaichi Electronics on December, 2019 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
December 13, 2017
0
Date of Patent
December 17, 2019
0
Patent Applicant
Patent Application Number
15840829
0
Patent Citations Received
Patent Inventor Names
Noah Beltran
0
Takeshi Nishimura
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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