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US Patent 10510602 Methods of producing self-aligned vias
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Is a
Patent
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Date Filed
August 29, 2018
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Date of Patent
December 17, 2019
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Patent Applicant
Micromaterials, Inc
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Patent Application Number
16116412
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Patent Citations
US Patent 10319604 Methods for self-aligned patterning
US Patent 10083834 Methods of forming self-aligned vias
US Patent 10319636 Deposition and treatment of films for patterning
Patent Inventor Names
Yung-Chen Lin
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Qingjun Zhou
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Uday Mitra
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Ying Zhang
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Abhijit Basu Mallick
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He Ren
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Ho-yung David Hwang
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
10510602
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Patent Primary Examiner
Brian Turner
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