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US Patent 10468363 Chiplets with connection posts

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
August 10, 2015
Date of Patent
November 5, 2019
Patent Application Number
14822864
Patent Citations
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US Patent 10103069 Pressure-activated electrical interconnection by micro-transfer printing
Patent Citations Received
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US Patent 12094851 Particle capture using transfer stamp
0
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US Patent 11495560 Chiplets with connection posts
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US Patent 11495561 Multilayer electrical conductors for transfer printing
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US Patent 12009347 Nano-tether micro LED structure
0
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US Patent 11488943 Modules with integrated circuits and devices
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US Patent 10741537 Semiconductor structure and manufacturing method thereof
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US Patent 10749093 Interconnection by lateral transfer printing
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US Patent 10944027 Pixel modules with controllers and light emitters
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US Patent 11587896 Transferrable pillar structure for fanout package or interconnect bridge
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US Patent 11251139 Secure integrated-circuit systems
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10468363
Patent Primary Examiner
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David A Zarneke

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