Is a
Patent attributes
Patent Applicant
0
Current Assignee
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Seungje Park0
Date of Patent
October 1, 2019
0Patent Application Number
149775880
Date Filed
December 21, 2015
0Patent Citations
Patent Citations Received
Patent Primary Examiner
Patent abstract
In a sensor assembly, a hole-shaped sensor support portion is formed at a sensor printed circuit board (PCB), a touch sensor is disposed at the sensor support portion, and an elastic member is installed at a rear surface of the sensor PCB. In addition, a sensor assembly according to an embodiment of the present invention may include a sensor PCB on which a copper coating film which constitutes a circuit is printed on a top surface of a plastic material, a touch sensor seated on a sensor support portion formed at the sensor PCB, and a cover member which is attached onto a rear surface of the sensor PCB and covers the sensor support portion.
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