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US Patent 10374710 Re-generation and re-transmission of millimeter waves for building penetration

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Is a
Patent
Patent

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10374710
Date of Patent
August 6, 2019
Patent Application Number
15926087
Date Filed
March 20, 2018
Patent Citations Received
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US Patent 12010703 Smart repeater systems
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US Patent 11956035 System and method for combining MIMO and mode-division multiplexing
0
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US Patent 11968593 Wireless communication network management for user devices based on real time mapping
0
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US Patent 11973568 RF signal repeater device management for 5G wireless networks
0
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US Patent 11553857 System and method for through window personal cloud transmission
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US Patent 10778332 Patch antenna for wave agility
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US Patent 10784962 System for millimeter wave building penetration using beam forming and beam steering
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US Patent 10854985 Smart infrastructure sensing and communication system
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Patent Primary Examiner
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Tuan Pham
Patent abstract

A system for enabling signal penetration into a building includes first circuitry, located on an outside of the building, for receiving signals at a first frequency that experiences losses when penetrating into an interior of the building and converting the received signals at the first frequency into a first format that overcome the losses caused by penetrating into the interior of the building over a wireless communications link. The first circuitry further includes a first transceiver, implementing a first transmission chipset for RF transmissions in the first format that counteracts losses occurring when penetrating into the interior of the building, for receiving the signals at the first frequency and converting the received signals at the first frequency into the first format that overcomes the losses caused by penetrating into the interior of the building. Second circuitry, located on the interior of the building is communicatively linked with the first circuitry for receiving and transmitting the converted received signals in the first format. The second circuitry further includes a second transceiver, implementing the first transmission chipset, for receiving and transmitting the converted signals in the first format from/to the first transceiver on the exterior of the building.

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