Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chikara Kondo0
Chiaki Dono0
Date of Patent
August 6, 2019
0Patent Application Number
152338210
Date Filed
August 10, 2016
0Patent Citations Received
...
Patent Primary Examiner
Patent abstract
Apparatuses and methods of data communication between semiconductor chips are described. An example apparatus includes: a first semiconductor chip and a second semiconductor chips that are stacked with each other via through substrate vias (TSVs) provided in one of the first semiconductor chip and the second semiconductor chip. The first semiconductor chip and the second semiconductor chips communicate with each other by use of data bus inversion data that have been encoded using a DBI algorithm.
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