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US Patent 10347515 Method for manufacturing workpieces and apparatus

Overview Structured Data Issues Contributors

Is a

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Date of Patent

July 9, 2019

Patent Application Number

14452883

Date Filed

August 6, 2014

Patent Citations

US Patent 10103046 Buffer chamber wafer heating mechanism and supporting robot

US Patent 10186441 Substrate processing apparatus and substrate processing method

Patent Citations Received

US Patent 12080571 Substrate processing module and method of moving a workpiece

4

US Patent 12002668 Thermal management hardware for uniform temperature control for enhanced bake-out for cluster tool

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6

US Patent 12074042 High-density substrate processing systems and methods

7

US Patent 11574826 High-density substrate processing systems and methods

US Patent 10998209 Substrate processing platforms including multiple processing chambers

US Patent 11590662 Robot for simultaneous substrate transfer

US Patent 11600507 Pedestal assembly for a substrate processing chamber

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Patent Primary Examiner

Patent abstract

For vacuum treatment of workpieces by a multitude of distinct processing stations (P11-P1n, P21-P2m) the processing stations are grouped in two groups (I and II). The workpieces are handled towards and from the processing stations of the first group (I) simultaneously, whereat the workpieces are treated by the processing stations of the second group (II) in a selectable individual sequence.

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