Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Vikram Venkatadri0
David Frank Bolognia0
Date of Patent
July 2, 2019
0Patent Application Number
148058350
Date Filed
July 22, 2015
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Various embodiments of a compact sensor module are disclosed herein. The sensor module can include a stiffener and a sensor substrate wrapped around a side of the stiffener. A sensor die may mounted on the sensor substrate. A processor substrate may be coupled to the sensor substrate. A processor die may be mounted on the processor substrate and may be in electrical communication with the sensor die.
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