US Patent 10309230 Co-formed element with low conductivity layer
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Patent abstract
A co-formed element includes a core structure which has a root portion and is formed from a high thermal conductivity ceramic matrix composite material, and a low thermal conductivity layer co-formed with the core structure and surrounding the root portion of the core structure.
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Patent Inventor Names
Michael G McCaffrey0
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US Patent 10309230 Co-formed element with low conductivity layer
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Patent applicant
Patent jurisdiction
Patent number
10309230
Date of patent
June 4, 2019
Patent application number
14773945
Date Filed
December 30, 2013
Patent primary examiner
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