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US Patent 10304765 Semiconductor device package

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
June 8, 2017
Date of Patent
May 28, 2019
Patent Application Number
15618084
Patent Citations Received
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US Patent 12087679 Package core assembly and fabrication methods
0
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US Patent 11931855 Planarization methods for packaging substrates
0
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US Patent 11476202 Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
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US Patent 11521935 Package structure and fabrication methods
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US Patent 11521937 Package structures with built-in EMI shielding
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US Patent 11232951 Method and apparatus for laser drilling blind vias
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US Patent 10886232 Package structure and fabrication methods
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US Patent 10937726 Package structure with embedded core
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US Patent 11063169 Substrate structuring methods
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US Patent 11257790 High connectivity device stacking
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10304765
Patent Primary Examiner
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Brook Kebede

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