Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Da Yeon Lee0
Hee Seok Jung0
Hwang Sub Koo0
Hyun Je Kim0
Sang Pil Kim0
Date of Patent
May 21, 2019
0Patent Application Number
159230170
Date Filed
March 16, 2018
0Patent Citations Received
Patent Primary Examiner
Patent abstract
The present invention provides a flexible circuit board having enhanced bending durability. The flexible circuit board comprises: a first board part; a second board part which extends from one side of the first board part and is thinner than the first board part so as to be bendable; and a third board part which extends from one side of the second board part and is thinner than the second board part so as to be bendable.
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