US Patent 10297571 Semiconductor package

According to one embodiment, a semiconductor package includes a substrate with first and second pad, first semiconductor chip above the substrate, first wire, first mold member, second semiconductor chip above the first mold member, third semiconductor chip above the second semiconductor chip, second wire, and a second mold member. The first wire electrically connects the first pad and the first semiconductor chip. The first mold member seals the first wire and the first semiconductor chip. The second wire electrically connects the second pad and the second semiconductor chip. The second mold member seals the second wire, the second and the third semiconductor chips, and the first mold member.