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US Patent 10294574 Levelers for copper deposition in microelectronics

Patent 10294574 was granted and assigned to MacDermid on May, 2019 by the United States Patent and Trademark Office.

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Patent
Patent
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Patent attributes

Patent Applicant
MacDermid
MacDermid
0
Current Assignee
MacDermid
MacDermid
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
102945740
Patent Inventor Names
Vincent Paneccasio, Jr.0
Eric Rouya0
Kyle Whitten0
Thomas Richardson0
Date of Patent
May 21, 2019
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Patent Application Number
148545610
Date Filed
September 15, 2015
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Patent Primary Examiner
‌
Stefanie S Wittenberg
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Patent abstract

A composition for electrolytic plating in microelectronics which contains a leveler that comprises the reaction product of an aliphatic di(t-amine) with an alkylating agent. Electrolytic plating methods employing the leveler, a method for making the leveler, and the leveler compound.

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