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US Patent 10289604 Memory processing core architecture

Patent 10289604 was granted and assigned to Wisconsin Alumni Research Foundation on May, 2019 by the United States Patent and Trademark Office.

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Patent abstractTimelineTable: Further ResourcesReferences
Is a
Patent
Patent
1

Patent attributes

Patent Applicant
Wisconsin Alumni Research Foundation
Wisconsin Alumni Research Foundation
1
Current Assignee
Wisconsin Alumni Research Foundation
Wisconsin Alumni Research Foundation
1
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
1
Patent Number
102896041
Patent Inventor Names
Jaikrishnan Menon1
Karthikeyan Sankaralingam1
Lorenzo De Carli1
Date of Patent
May 14, 2019
1
Patent Application Number
144539901
Date Filed
August 7, 2014
1
Patent Citations Received
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US Patent 11790219 Three dimensional circuit implementing machine trained network
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US Patent 10892252 Face-to-face mounted IC dies with orthogonal top interconnect layers
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US Patent 10950547 Stacked IC structure with system level wiring on multiple sides of the IC die
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US Patent 10970627 Time borrowing between layers of a three dimensional chip stack
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US Patent 10978348 3D chip sharing power interconnect layer
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US Patent 11599299 3D memory circuit
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US Patent 11289333 Direct-bonded native interconnects and active base die
‌
US Patent 11557516 3D chip with shared clock distribution network
...
Patent Primary Examiner
‌
S. Sough
1
Patent abstract

Aspects of the present invention provide a memory system comprising a plurality of stacked memory layers, each memory layer divided into memory sections, wherein each memory section connects to a neighboring memory section in an adjacent memory layer, and a logic layer stacked among the plurality of memory layers, the logic layer divided into logic sections, each logic section including a memory processing core, wherein each logic section connects to a neighboring memory section in an adjacent memory layer to form a memory vault of connected logic and memory sections, and wherein each logic section is configured to communicate directly or indirectly with a host processor. Accordingly, each memory processing core may be configured to respond to a procedure call from the host processor by processing data stored in its respective memory vault and providing a result to the host processor. As a result, increased performance may be provided.

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