US Patent 10269769 System in package with vertically arranged radio frequency componentry

A packaged module for use in a wireless communication device has a substrate supporting a first integrated circuit die that implements at least a portion of a radio frequency baseband subsystem and a second integrated circuit die that implements at least a portion of a radio frequency front end including a radio frequency power amplifier. The substrate is disposed between the first integrated circuit die and the second integrated circuit die. An overmold encloses one of the first integrated circuit die and the second integrated circuit die.