US Patent 10266327 Separable blister card package

Patent 10266327 was granted and assigned to Placon Corporation on April, 2019 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

Placon Corporation

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

10266327

Date of Patent

April 23, 2019

Patent Application Number

15209526

Date Filed

July 13, 2016

Patent Primary Examiner

‌

Rafael A Ortiz

Patent abstract

A disposable package is configured to promote recycling of its component parts. A thermoformed thermoplastic blister has a product bubble which extends from a peripheral flange to extend through an opening in a front card. The front card is affixed to a back card so as not to adhere to the blister flange. An extraction tab extends from the product bubble into the front card opening to be accessible from both the front and back of the package being thereby accessible for gripping by a user to engage and remove the blister from the front card and the back card.