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US Patent 10256618 Conductive surfacing material for composite structures

Patent 10256618 was granted and assigned to Cytec Industries on April, 2019 by the United States Patent and Trademark Office.

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Patent
Patent
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Patent attributes

Patent Applicant
Cytec Industries
Cytec Industries
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Current Assignee
Cytec Industries
Cytec Industries
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
102566180
Patent Inventor Names
Junjie Jeffrey Sang0
Dalip Kumar Kohli0
Date of Patent
April 9, 2019
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Patent Application Number
154462430
Date Filed
March 1, 2017
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Patent Primary Examiner
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John L Goff, II
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Patent abstract

An electrically conductive surfacing material capable of providing sufficient conductivity for lightning strike protection (LSP) and/or electromagnetic interference (EMI) shielding is disclosed. The conductive surfacing material is a multi-layered structure having a very thin conductive layer (e.g. solid metal foil) and a resin film formed on at least one surface of the conductive layer. The resin film is formed from a curable resin composition containing an epoxy novolac resin, a tri-functional or tetra-functional epoxy resin, ceramic microspheres, a latent amine-based curing agent, particulate inorganic fillers; and a toughening component. Optionally, the resin film further includes conductive additives to increase electrical conductivity of the surfacing material. The resin film exhibits high Tg as well as high resistance to paint stripper solutions. Furthermore, the conductive surfacing material is suitable for co-curing with fiber-reinforced resin composite substrates.

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