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US Patent 10256180 Package structure and manufacturing method of package structure

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
March 17, 2017
Date of Patent
April 9, 2019
Patent Application Number
15461499
Patent Citations Received
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US Patent 12087679 Package core assembly and fabrication methods
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US Patent 11887934 Package structure and fabrication methods
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US Patent 11927885 Fluoropolymer stamp fabrication method
0
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US Patent 11931855 Planarization methods for packaging substrates
0
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US Patent 11476202 Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration
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US Patent 11521935 Package structure and fabrication methods
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US Patent 11521937 Package structures with built-in EMI shielding
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US Patent 11232951 Method and apparatus for laser drilling blind vias
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US Patent 10886232 Package structure and fabrication methods
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US Patent 10937726 Package structure with embedded core
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•••
Patent Inventor Names
Wen-Chun Liu
0
Wei-Jen Lai
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10256180
Patent Primary Examiner
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Andargie M Aychillhum

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