Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Murad Kurwa0
Anwar Mohammed0
David Geiger0
Zhen Feng0
Weifeng Liu0
Date of Patent
March 12, 2019
0Patent Application Number
143072010
Date Filed
June 17, 2014
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Methods of making a copper interconnect plated through hole assembly are disclosed. Nano copper ink dispersed in an organic solvent is able to be filled in the plated through hole and forming the copper interconnect by sintering at a temperature below the melting of the copper.
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