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US Patent 10211171 Antenna in embedded wafer-level ball-grid array package
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Patent
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Date Filed
September 14, 2017
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Date of Patent
February 19, 2019
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Patent Application Number
15705078
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Patent Citations Received
US Patent 11469191 Antenna in embedded wafer-level ball-grid array package
US Patent 10402620 Fan-out semiconductor package
US Patent 10636753 Antenna in embedded wafer-level ball-grid array package
US Patent 11791534 Antenna package for signal transmission
US Patent 11373922 Semiconductor packages having thermal through vias (TTV)
US Patent 12094843 Antenna in embedded wafer-level ball-grid array package
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Patent Inventor Names
Kai Liu
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Yaojian Lin
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
10211171
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Patent Primary Examiner
Yosef Gebreyesus
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