US Patent 10211122 Semiconductor module including a case and base board

An object of the present invention is to provide a semiconductor module with high heat dissipation at a low cost. A semiconductor module according to the present invention includes: a case having a hollow portion; a base board made of an aluminum alloy having a first portion corresponding to the hollow portion of the case, and a second portion corresponding to a main body portion of the case, the base board being attached to a bottom face of the case via the second portion; a ceramic insulating substrate disposed on the first portion of the base board; a wiring pattern disposed on the ceramic insulating substrate; semiconductor elements disposed on the wiring pattern; metal wiring boards connected to the semiconductor elements; and a sealing resin that seals the hollow portion of the case.