US Patent 10205298 Packaging structure for four-channel integrated tunable laser array chip

A packaging structure for a four-channel integrated tunable laser array chip (100) comprises a carrier (200), a cryogenic refrigerator (300), a lens assembly (400), an isolator assembly (500), a package (600), a transition ring (700), and a thermistor. The packaging structure for the four-channel integrated tunable laser array chip (100) can realize a flexible tuning upon an active coupling of optical paths and ensure a reasonable switching of optical paths between optical assemblies, thereby improving a coupling efficiency for the optical paths and increasing a transmission distance of a digital signal. Furthermore, a design of a radio frequency circuit ensures integrity of a transmitted signal and reduces loss during the transmission.